Flip Chip Packaging Substrate Manufacturing

Flip Chip Packaging Substrate Manufacturing. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Such as: 10 layer Package Substrates. 12 Layer Package Substrates. 14 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a substrate with less than 10 layers. We have used the Msap technology to produce the track width/spacing with 12um/12um.

Flip chip packaging has revolutionized the field of microelectronics, transforming the design and production of electronic devices. At the core of this technology lies the flip chip packaging substrate, a vital component facilitating electrical and mechanical connections between the integrated circuit (IC) and the package. This